Enrgtech
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tfm-130-01-s-d-re1-wt Samtec TFM Series Vertical Surface, Through Hole PCB Header, 60 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded
tfm-130-01-s-d-re1-wt Samtec TFM Series Vertical Surface, Through Hole PCB Header, 60 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

Samtec TFM Series Vertical Surface, Through Hole PCB Header, 60 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

Samtec TFM Series Vertical Surface, Through Hole PCB Header, 60 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

Manufacturer:
Samtec
Manufacturer Part No:
TFM-130-01-S-D-RE1-WT
Enrgtech Part No:
ET28452510
Warranty:
Manufacturer
SAR 12.33 SAR 12.33
Checking for live stock
Product Type:
PCB Header
Series:
TFM
Pitch:
1.27mm
Current:
3.7A
Housing Material:
Liquid Crystal Polymer
Number of Contacts:
60
Number of Rows:
2
Orientation:
Vertical
Shrouded/Unshrouded:
Shrouded
Mount Type:
Surface, Through Hole
Contact Material:
Phosphor Bronze
Contact Plating:
Gold, Tin over Nickel
Minimum Operating Temperature:
-55°C
Row Pitch:
1.27mm
Termination Type:
Solder
Maximum Operating Temperature:
125°C
Standards/Approvals:
MIL-DTL-55302, SET
Voltage:
275 V
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A700000014180457.pdf(datasheets)
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