Discover the Hirose FX23L-60S-0.5SV, a high-density, ultra-low-profile mezzanine board-to-board receptacle connector designed for compact electronic assemblies worldwide. Featuring 64 positions (60 signal + 4 power), 0.5 mm pitch, and 5.8 mm height above board, it delivers PCIe Gen 4‑capable data transmission up to 16 Gbps. With gold‑plated copper alloy contacts, floating alignment tolerance ±0.6 mm, and rugged SMT/THR mounting, this connector is engineered for automotive, industrial, and high‑performance consumer systems.
